Storage apparatus, card type string apparatus, and electronic apparatus

ABSTRACT

A storage apparatus  10  is disclosed, that comprises a wiring substrate  11  having a first surface and a second surface, a flat type external connection terminal  12   a  disposed on the first surface of the wiring substrate  11,  a semiconductor device  14  disposed on the second surface of the wiring substrate  11  and having a connection terminal  14   a  connected to the flat type external connection terminal  12   a , a molding resin  15  for coating the semiconductor device  14  on the second surface of the wiring substrate  11,  a card type supporting frame  10   a  having a concave portion or a hole portion fitting the wiring substrate  11,  the semiconductor device  14,  and the molding resin  15  in such a manner that the flat type external connection terminal  12   a  is exposed to the first surface of the wiring substrate  11,  and adhesive resin a adhering integrally the flat type external connection terminal  12   a , the wiring substrate  11,  the semiconductor device  14,  the molding resin  15,  and the card type supporting frame  10   a . In addition, the storage apparatus  10  can be combined with a card type supporting means  21  that supports detachably with the flat type external connection terminal  12   a  exposed to one of the surfaces so as to be used as a card type storage apparatus  20  having bigger size.

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a storage apparatus, inparticular, to a backward compatible storage apparatus suitable fortransferring and exchanging digital information between various portableelectronic apparatuses. In addition, the present invention relates to acard type storage apparatus, in particular, to a card type storageapparatus suitable for transferring and exchanging digital informationbetween various portable electronic apparatuses.

[0003] Moreover, the present invention relates to various portablewireless terminals such as a personal computer, a portable informationterminal, a portable telephone unit, and a PHS (Personal HandyphoneSystem) unit and various electronic apparatuses such as a digital cameraand a voice recorder.

[0004] 2. Description of the Related Art

[0005] In recent years, various types of information such as characters,still pictures, moving pictures, music, and voice are handled as digitaldata. Various types of storage mediums such as a magnetic tape, a floppydisk, a hard disk, and a magneto-optical disc have been used to recordsuch types of digital data.

[0006] For example, a floppy disk is a most-widely used storage medium.However, since the medium should be rotatably-driven, a motor and arotating mechanism are essentially required for a floppy disk drive.Thus, the floppy disk could not be a medium suitable for an electronicapparatus that is small and light.

[0007] In addition, portable wireless terminals such as portabletelephone units and PHS units have become common and their size andweight have been reduced. However, such wireless terminals do not havedetachable storage apparatuses. Thus, when a wireless terminal such as aportable telephone unit or a PHS unit is replaced with a new model, thedirectory and various settings of the old unit may not be used for thenew unit. Thus, the contents of the directory and settings of the oldunit should be manually input to the new unit.

[0008] A digital camera with a floppy disk drive that recordsphotographed pictures on a floppy disk has been proposed. With such adigital camera, since photographed pictures are recorded on a floppydisk, the pictures can be used with a PC (Personal Computer) or thelike. However, the size and weight of the digital camera depend on thoseof the floppy disk. Thus, since the digital camera becomes large andheavy, it is not suitable as a portable apparatus.

[0009] The storage apparatuses that such portable electronic apparatuseshave do not satisfy both requirements of compatibility with otherelectronic apparatuses of prior generations and small/light structurenecessary for portable apparatuses.

[0010] Thus, a storage apparatus that satisfies both requirements ofcompatibility with other electronic apparatuses of prior generations andsmall/light structure is required.

SUMMARY OF THE INVENTION

[0011] The present invention is made from the above-described point ofview. An object of the present invention is to provide a storageapparatus that is small, thin, and light.

[0012] Another object of the present invention is to provide a storageapparatus that has compatibility with other electronic apparatuses ofprior generations and that has small, thin, and light structure.

[0013] To solve such problems, the storage apparatus, the card typestorage apparatus, and the electronic apparatus according to the presentinvention have the following structures.

[0014] The present invention is a storage apparatus, comprising a wiringsubstrate having a first surface and a second surface, a flat typeexternal connection terminal disposed on the first surface of the wiringsubstrate, a semiconductor device disposed on the second surface of thewiring substrate and having a connection terminal connected to the flattype external connection terminal, and a card type molding resin forcoating the semiconductor device on the second surface of the wiringsubstrate with the same height as an exposed surface of the flat typeexternal connection terminal.

[0015] The present invention is a storage apparatus, comprising a wiringsubstrate having a first surface and a second surface, a flat typeexternal connection terminal disposed on the first surface of the wiringsubstrate, a semiconductor device disposed on the second surface of thewiring substrate and having a connection terminal connected to the flattype external connection terminal, molding resin for coating thesemiconductor device on the second surface of the wiring substrate, acard type supporting frame having a concave portion or a hole portionformed on at least one surface of the card type supporting frame, theconcave portion or the hole portion fitting the wiring substrate, thesemiconductor device, and the molding resin in such a manner that theflat type external connection terminal is exposed to the first surfaceof the wiring substrate, and adhesive resin filled in a supporting spaceformed among the flat type external connection terminal, the wiringsubstrate, the molding resin, and the card type supporting frame so asto integrally adhere the flat type external connection terminal, thewiring substrate, the semiconductor device, the molding resin, and thecard type supporting frame.

[0016] A molding resin free portion is formed at an edge portion of theflat type external connection terminal. A concave portion or a holeportion of the card type supporting frame can be a shouldered concaveportion or a shouldered hole portion having a first portion and a secondportion, the first portion being fitted to the molding resin freeportion of the flat type external connection terminal, the secondportion being fitted to the molding resin portion of the flat typeexternal connection terminal.

[0017] The area of the card type molding resin portion of the storageapparatus or the area of the card type supporting frame is the half orless of the area of the flat type external connection terminal.

[0018] The molding resin is preferably disposed on the second surface ofthe wiring substrate in such a manner that the molding resin isunsymmetrically disposed in one symmetrical direction on the secondsurface of the wiring substrate. In the following description, “moldingresin unsymmetrically disposed in one symmetrical direction” representsfor example a rectangular substrate that is symmetrical with respect toa first line in parallel with the longer side of the substrate andpassing through the center of the substrate and that is not symmetricalwith respect to a second line perpendicular to the first line. Themolding resin may have a mark, for example arrow, that represents adirection parallel to the symmetrical direction. Thus, since the storageapparatus is unsymmetrically shaped, the storage apparatus can besecurely and easily attached to the host side unit. The mark ispreferably a linear pattern. When a concave pattern is formed on thesurface, the area becomes thin. Thus, the strength of the storageapparatus deteriorates. On the other hand, when a convex pattern isformed, since the thickness of the storage apparatus becomes large, therequirement for small and thin structure cannot be satisfied.

[0019] In addition, with the molding resin having one or plural notchesthe storage apparatus is unsymmetrically shaped and voltage displayfunction or discrimination function and the like is provided. When themolding resin have notch, one symmetrical direction is not realized.

[0020] The semiconductor device may be a serial access typesemiconductor. The semiconductor device may be a flash memory. Thesemiconductor device may be a NAND type EEPROM or an AND type EEPROM.

[0021] The serial access type semiconductor device sequentially inputsand outputs read data, write data, and commands through common I/O pins.The serial access type semiconductor device does not have an addressterminal.

[0022] Thus, regardless of the integration degree of the semiconductordevice, the structure of the flat type external connection terminal (forexample, the number of pins) can be standardized.

[0023] The flat type external connection terminal may be composed of aconductor layer disposed on the first surface of the wiring substrateand having a slit for separating the first surface into a plurality ofareas. Thus, the most portion of the surface of the wiring substrate canbe coated with copper, gold, or the like. Consequently, the strength ofthe storage apparatus improves.

[0024] A pattern of the slit may connect any two points of the outerperiphery of the conductor layer as a curved line or a bent line. Thus,the strength of the storage apparatus against bending force and twistingforce improves.

[0025] The wiring substrate may have a barrier layer composed of metal,for example gold, the barrier layer being exposed to the molding resinfree area on the second surface. Thus, when mold resin is formedcorresponding to transfer mold method, the productivity improves. Inother words, a gate from which non-harden resin is filled is formed onthe barrier layer. Although resin such as prepreg of the wiringsubstrate securely adheres to the mold resin, such resin can be easilypeeled off on the barrier layer.

[0026] The barrier layer may be electrically insulated from a connectionterminal of the storage apparatus.

[0027] The present invention is a card type storage apparatus,comprising a storage apparatus having a wiring substrate having a firstsurface and a second surface, a flat type external connection terminaldisposed on the first surface of the wiring substrate, a semiconductordevice disposed on the second surface of the wiring substrate and havinga connection terminal connected to the flat type external connectionterminal, and molding resin for coating the semiconductor device on thesecond surface of the wiring substrate, and a card type supporting meanshaving a first surface and for detachably supporting the storageapparatus in such a manner that the flat type external connectionterminal is exposed to the first surface of the card type supportingmeans.

[0028] The present invention is a card type storage apparatus,comprising a storage apparatus having a wiring substrate having a firstsurface and a second surface, a flat type external connection terminaldisposed on the first surface of the wiring substrate, a semiconductordevice disposed on the second surface of the wiring substrate and havinga connection terminal connected to the flat type external connectionterminal, molding resin for coating the semiconductor device on thesecond surface of the wiring substrate, a card type supporting framehaving a concave portion or a hole portion formed on at least onesurface of the card type supporting frame, the concave portion or thehole portion fitting the wiring substrate, the semiconductor device, andthe molding resin in such a manner that the flat type externalconnection terminal is exposed to the first surface of the wiringsubstrate, and adhesive resin filled between at least one of the flattype external connection terminal, the wiring substrate, thesemiconductor device and the molding resin, and the card type supportingframe so as to adhere integrally the flat type external connectionterminal.

[0029] In the card type storage apparatus, the storage apparatusaccording to the present invention is detachably attached to thesupporting means. Thus, the storage apparatus can be easily handled.

[0030] The supporting means has a concave portion and a slit formed onthe first surface thereof. The card type supporting frame is insertedinto the concave portion. The slit is formed on both edge surfaces ofthe concave portion along the insertion direction of the card typemolding resin or the card type supporting frame. Thus, the card typemolding resin or the card type supporting frame can be fitted to thesupporting means.

[0031] The supporting means has a tapered overhang portion for nippingthe card type molding resin portion or the card type supporting frame,the tapered overhang portion being disposed on both edge surfaces of theconcave portion along the insertion direction.

[0032] The supporting means has a concave portion with a shouldercorresponding to a molding resin area on the second surface of thewiring substrate and an exposed area on the first surface of thesupporting means. In other words, in the storage apparatus according tothe present invention, the molding resin is not disposed symmetricallywith the second surface of the wiring substrate. Thus, the card thatsupports the storage apparatus should have a concave portioncorresponding to the molding resin.

[0033] Consequently, the storage apparatus can be correctly attached tothe supporting means. Thus, the storage apparatus can be prevented frommalfunctioning and being damaged.

[0034] The depth of the concave portion may be larger than the thicknessof the storage apparatus.

[0035] Thus, the semiconductor device can be protected against thestress applied in the direction of the thickness of the card typestorage apparatus. The supporting means may be flexible.

[0036] The bottom portion of the supporting menas that forms the concaveportion may be composed of a metal plate such as a SUS plate so as toreinforce it.

[0037] The card type storage apparatus may further comprise a securingmeans for securing the storage apparatus supported by the supportingmeans.

[0038] Although the securing means secures the storage apparatus to thecard type supporting means (the support card), the securing ispreferably detachably structured. The securing means may be adouble-adhesive tape or adhesive resin layer and the like disposed atthe shoulder portion of the supporting means.

[0039] The adhesive strength between the double-adhesive tape and thesupporting means is larger than the adhesive strength between thedouble-adhesive tape and the storage apparatus. Thus, the storageapparatus can be repeatedly attached and detached to/from the supportingmeans.

[0040] In addition, either the storage apparatus or the supporting meanshas a convex portion and the other one has a concave portion fitting tothe convex portion. Thus, when the storage apparatus is inserted intothe supporting means, the storage apparatus and the supporting means fitat the uneven part and detach each other with a designated power in thedirection to separate.

[0041] The present invention is a card type storage apparatus,comprising a storage apparatus having a wiring substrate having a firstsurface and a second surface, a flat type external connection terminaldisposed on the first surface of the wiring substrate, a semiconductordevice disposed on the second surface of the wiring substrate and havinga connection terminal connected to the flat type external connectionterminal, and molding resin for coating the semiconductor device on thesecond surface of the wiring substrate, and a card type supporting meanshaving a first surface and for supporting the storage apparatus in sucha manner that the flat type external connection terminal is exposed tothe first surface of the card type supporting means, wherein thesupporting means is composed of a first portion and a second portion,the first portion surrounding the storage apparatus, the second portionbeing detachably connected to the first portion.

[0042] The second portion may have a slit for fitting the first portion.

[0043] The second portion may have an opening portion for fitting thefirst portion.

[0044] An edge surface of the first portion may be tapered. An edge ofthe opening portion of the second portion may have an overhang portionfor nipping the edge surface of the first portion.

[0045] The first portion and the second portion may have a concaveportion and a convex portion so as to secure the first portion and thesecond portion.

[0046] The second portion may be composed of a material withflexibility.

[0047] The card type storage apparatus according to the presentinvention complies with JEDEC MO-180 standard. In particular, thethickness of the card type storage apparatus should strictly comply withthe standard. In other words, the thickness of the card type storageapparatus is 0.76 mm±0.08 mm or 1.4 mm±0.1 mm. The outer size of thecard type storage apparatus is 37.0 mm (wide)×45.0 mm (long).

[0048] The present invention is an electronic apparatus, comprising (a)a storage apparatus having a wiring substrate having a first surface anda second surface, a flat type external connection terminal disposed onthe first surface of the wiring substrate, a semiconductor devicedisposed on the second surface of the wiring substrate and having aconnection terminal connected to the flat type external connectionterminal, and a card type molding resin layer for coating thesemiconductor device on the second surface of the wiring substrate withthe same height as the exposed surface of the flat type externalconnection terminal, (b) a supporting means for supporting the storageapparatus, (c) a connection electrode that is contacted to the flat typeconnection terminal when the storage apparatus is supported by thesupporting means, and (d) a driving circuit for accessing thesemiconductor device through the connection electrode and the flat typeexternal connection terminal.

[0049] The present invention is an electronic apparatus, comprising (a)a wiring substrate having a first surface and a second surface, a flattype external connection terminal disposed on the first surface of thewiring substrate, a semiconductor device disposed on the second surfaceof the wiring substrate and having a connection terminal connected tothe flat type external connection terminal, molding resin for coatingthe semiconductor device on the second surface of the wiring substrate,a card type supporting frame having a concave portion or a hole portionformed on at least one surface of the card type supporting frame, theconcave portion or the hole portion fitting the wiring substrate, thesemiconductor device, and the molding resin in such a manner that theflat type external connection terminal is exposed to the first surfaceof the wiring substrate, and adhesive resin filled in a supporting spaceformed among the flat type external connection terminal, the wiringsubstrate, the semiconductor device, the molding resin, and the cardtype supporting frame so as to integrally adhere the flat type externalconnection terminal, the wiring substrate, the semiconductor device, themolding resin, and the card type supporting frame, (b) a supportingmeans for supporting the storage apparatus, (c) a connection electrodethat is contacted to the flat type connection terminal when the storageapparatus is supported by the supporting means, and (d) a drivingcircuit for accessing the semiconductor device through the connectionelectrode and the flat type external connection terminal.

[0050] It is preferred that the driving circuit serially accesses thesemiconductor device.

[0051] According to the present invention, since the molding resin isunsymmetrically disposed on the wiring substrate, the storage apparatuscan be properly attached to the host side unit. Thus, characteristics ofsmall, thin, and light structure are satisfied, the user can easily knowthe attaching direction of the storage apparatus to the host side unit.Consequently, the semiconductor apparatus can be prevented frommalfunctioning and being damaged.

[0052] According to the present invention, since the molding resin isunsymmetrically disposed on the wiring substrate, the storage apparatuscan be properly attached to the host side unit. Thus, theuser-friendliness improves. In addition, the semiconductor apparatus canbe prevented from malfunctioning and being damaged.

[0053] In the storage apparatus according to the present invention,since the serial access type memory device and the flat type externalconnection terminal are used in combination, the outer size of thestorage apparatus becomes close to the outer size of the memory device.Thus, the storage apparatus according to the present invention issuitable for an external storage apparatus used in a small mobilecommunication terminal such as a portable telephone unit, a PHS unit, apocket bell, or a PDA.

[0054] In addition, when the serial access type memory device and theflat type external connection terminal are used in combination, thestructure of the flat type external connection electrodes of the storageapparatus and the structure of the host side electronic apparatus can bestandardized.

[0055] In the card type storage apparatus according to the presentinvention, since the molding resin of the storage apparatus isunsymmetrically fitted to the support card, the storage apparatus can beproperly attached to the support card. Thus, the user-friendlinessimproves. Consequently, the storage apparatus can be prevented frommalfunctioning and being damaged.

[0056] In the card type storage apparatus according to the presentinvention, since the support card is separated into a plurality ofportions, the storage apparatus can be connected to a host side unitthat is smaller than the outer size of the support card.

[0057] In the electronic apparatus according to the present invention,the storage apparatus can be properly attached to the electronicapparatus. Thus, when the storage apparatus is connected to a host sideelectronic apparatus such as a portable telephone unit, a PHS unit, apocket bell, a PDA, a PC, or a digital camera, the electronic apparatuscan be prevented from malfunctioning or being damaged. In addition, theuser-friendliness remarkably improves. So far, it was difficult toaccomplish an external connecting unit that can be used in common with aportable telephone unit, a PHS unit, a pocket bell, a PDA unit, adigital camera, a note type PC, a PC, and so forth. However, with thestorage apparatus and the electronic apparatus according to the presentinvention, data such as telephone numbers registered to a portabletelephone unit, text data, picture data, and so forth received throughInternet can be transferred to and shared with other informationprocessing units.

[0058] These and other objects, features and advantages of the presentinvention will become more apparent in light of the following detaileddescription of a best mode embodiment thereof, as illustrated in theaccompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

[0059]FIG. 1 is a perspective front view showing an example of thestructure of a storage apparatus according to a first embodiment of thepresent invention;

[0060]FIG. 2 is a perspective rear view showing the structure of thestorage apparatus shown in FIG. 1;

[0061]FIG. 3A is a side view on a shorter side of the storage apparatusshown in FIG. 1;

[0062]FIG. 3B is side view parallel to the storage apparatus on a longerside shown in FIG. 1;

[0063]FIG. 4 is a sectional view showing an example of the structure ofthe storage apparatus according to the first embodiment of the presentinvention;

[0064]FIG. 5A is perspective view showing an example of the structure ofa card type storage apparatus according to a second embodiment of thepresent invention;

[0065]FIG. 5B is perspective view showing an example of the structure ofa support cad of a storage apparatus according to a second embodiment ofthe present invention;

[0066]FIG. 6 is a sectional view showing an example of the structure ofan electronic apparatus according to a third embodiment of the presentinvention;

[0067]FIG. 7 is a sectional view showing an example of the structure ofan electronic apparatus according to the third embodiment of the presentinvention;

[0068]FIG. 8 is a perspective view showing an example of the structureof connection electrodes of the electronic apparatus according to thethird embodiment of the present invention;

[0069]FIG. 9 is a plan view showing another example of the structure ofa card type storage apparatus according to a fourth embodiment of thepresent invention;

[0070]FIG. 10 is a plan view showing another example of the structure ofthe card type storage apparatus according to the fourth embodiment ofthe present invention;

[0071]FIG. 11 is a plan view showing another example of the structure ofthe card type storage apparatus according to the fourth embodiment ofthe present invention;

[0072]FIG. 12 is a plan view showing another example of the structure ofthe card type storage apparatus according to the fourth embodiment ofthe present invention;

[0073]FIG. 13 is a plan view showing another example of the structure ofthe card type storage apparatus according to the fourth embodiment ofthe present invention;

[0074]FIG. 14 is a plan view showing another example of the structure ofthe card type storage apparatus according to the fourth embodiment ofthe present invention;

[0075]FIG. 15 is a plan view showing the state that the first area isdetached from the second area in the example of FIG. 10;

[0076]FIG. 16 is a plan view showing the state that the first area isdetached from the second area in the example of FIG. 12;

[0077]FIG. 17 is a plan view showing the state that the first area isdetached from the second area in the example of FIG. 13;

[0078]FIG. 18 is a plan view showing the state that the first area isdetached from the second area in the example of FIG. 14;

[0079]FIG. 19A is a sectional views parallel to a shorter side of thestorage apparatus of FIG. 12;

[0080]FIG. 19B is a sectional view parallel to a longer side of thestorage apparatus of FIG. 12;

[0081]FIG. 19C is a sectional view, parallel to a longer side of thestorage apparatus of FIG. 10;

[0082]FIG. 19D is a sectional view, showing another example of thestructure, parallel to a longer side of the storage apparatus accordingto the fourth embodiment of the present invention;

[0083]FIG. 20 is a perspective view showing an example of the structureof a card type storage apparatus according to a fifth embodiment of thepresent invention;

[0084]FIG. 21 is a perspective view showing an example of the structureof a card type storage apparatus according to a sixth embodiment of thepresent invention;

[0085]FIG. 22A is a plan view showing an example of the structure of acard type storage apparatus according to a seventh embodiment of thepresent invention;

[0086]FIG. 22B is a sectional view taken along line A-A shown in FIG.22A;

[0087]FIG. 22C is a perspective view showing the state that a first area21 a is attached to a second area 21 b shown in FIG. 22A;

[0088]FIG. 22D is a sectional view taken along line B-B shown in FIG.22A;

[0089]FIG. 23A is a plan view showing an example of the structure of asupport card of a card type storage apparatus according to an eighthembodiment of the present invention;

[0090]FIG. 23B is a sectional view taken along line A-A shown in FIG.23A;

[0091]FIG. 23C is a sectional view of a support card in anotherembodiment corresponding to FIG. 23B;

[0092]FIG. 24A is a plan view showing another example of the structureof a card type storage apparatus according to the eighth embodiment ofthe present invention;

[0093]FIG. 24B is a sectional view taken along line B-B shown in FIG.24A;

[0094]FIG. 24C is a sectional view taken along line C-C shown in FIG.24A;

[0095]FIG. 25A is a perspective view showing another example of thestructure of a storage apparatus of a card type storage apparatusaccording to the eighth embodiment of the present invention; and

[0096]FIG. 25B is a sectional view taken along line A-A shown in FIG.25A; and

[0097]FIG. 25C is a perspective view showing the storage apparatus ofFIG. 25A and a support card.

[0098]FIG. 26 is a block diagram showing the structure of which a cardtype storage apparatus according to the present invention is applied toa picture/audio storing medium for a digital audio system.

DESCRIPTION OF PREFERRED EMBODIMENTS

[0099] Next, embodiments of the present invention will be described indetail.

[0100] (First Embodiment)

[0101]FIGS. 1 and 2 are a perspective front view and a perspective rearview showing an example of the structure of a storage apparatusaccording to a first embodiment of the present invention, respectively.

[0102]FIG. 3A is a sectional view on a shorter side of the storageapparatus shown in FIGS. 1 and 2. FIG. 3B is a sectional view on alonger side of the storage apparatus shown in FIGS. 1 and 2.

[0103]FIG. 4 is a detailed sectional view showing an example of thestructure of the storage apparatus parallel to the first embodiment ofthe present invention on a shorter side.

[0104] In FIG. 4, reference numeral 10 is a storage apparatus. Thestorage apparatus 10 comprises a wiring substrate 11, a flat typeexternal connection terminal 12 a, a semiconductor device 14, andmolding resin 15. The wiring substrate 11 has a first surface and asecond surface. The flat type external connection terminal 12 a isdisposed on the first surface of the wiring substrate 11. Thesemiconductor device 14 is disposed on the second surface of the wiringsubstrate 11. The semiconductor device 14 has a connection terminal 14 aconnected to the flat type external connection terminal 12 a. Themolding resin 15 unsymmetrically coats the semiconductor device 14 onthe second surface of the wiring substrate 11.

[0105] In the example, the semiconductor device 14 is disposed at aconcave portion on the upper surface (second surface) of the wiringsubstrate 11 through a bonding agent layer (not shown). The connectionterminal 14 a of the semiconductor device 14 and the connection terminal12 b of the wiring substrate 11 are connected with a bonding wire 16.The connection terminal 12 b of the wiring substrate and the flat typeexternal connection terminal 12 a are connected through a via-hole 12 h.Since the semiconductor device 14 is disposed at the concave portionformed on the upper surface of the wiring substrate 11, the height ofthe storage apparatus is reduced.

[0106] In the example, the semiconductor device 14 is a NAND type EEPROMthat is a serial access memory device. Alternatively, as thesemiconductor device 14, an AND type EEPROM or another memory device canbe used.

[0107] The semiconductor device 14 may be connected to the wiringsubstrate 11 with a flip-chip using conductive bumps (corresponding toface-down bonding method) rather than the bonding wires 16. In addition,the layers of the wiring substrate 11 may be connected with conductivepillars rather than the via-holes 14 h.

[0108] In the storage apparatus 10 according to the present invention,the molding resin 15 is unsymmetrically disposed on the second surfaceof the wiring substrate 11. In the example, the molding resin 15deviates to the longer side of the wiring substrate 11.

[0109] In such a structure, the storage apparatus according to thepresent invention can be correctly attached to (inserted into) a hostside electronic apparatus 30. Thus, the storage apparatus can beprevented from malfunctioning and being damaged. The host sideelectronic apparatus is for example a portable telephone unit, a PHSunit, a pocket bell (beeper), a PDA, a PC (Personal Computer), and adigital camera.

[0110] In the example, as shown in FIG. 2, a mark 17 that represents theinserting direction of the storage apparatus is placed on the frontsurface of the molding resin 15. The mark 17 is preferably formed with alinear pattern rather than a concave patter or a convex pattern.

[0111] On the second surface of the wiring substrate 11 (namely, on thesurface of which the semiconductor device 14 is disposed), a metalbarrier 18 is disposed along with a wiring pattern on the wiringsubstrate 11. With the metal barrier 18, when the molding resin 15 isformed with transfer mold or the like, the strength of the wiringsubstrate 11 improves. In addition, the resin can be easily peeled off amold.

[0112] Since text data, picture data, music data, medical data,financial data, various types of authentication data, and so forth canbe handled with the storage apparatus according to the presentinvention, data can be exchanged among a plurality of host sideelectronic apparatuses. In addition, the storage apparatus according tothe present invention can highly maintain compatibility with variouselectronic apparatuses.

[0113] (Second Embodiment)

[0114]FIG. 5A is a perspective view showing an example of the structureof a card type storage apparatus according to a second embodiment of thepresent invention, and FIG. 5B is a perspective view showing a supportcard of the card type storage apparatus.

[0115] In the card type storage apparatus, the storage apparatusaccording to the first embodiment of the present invention is held by asupport card.

[0116] In FIGS. 5A and 5B, reference numeral 20 is a card type storageapparatus 20 according to the second embodiment of the presentinvention. The card type storage apparatus 20 comprises a storageapparatus 10 according to the first embodiment of the present inventionand a support card 21. The support card 21 detachably supports thestorage apparatus 10 in such a manner that the flat type externalconnection terminal 12 a is exposed.

[0117] The support card 21 has a concave portion 22 that supports thestorage apparatus 10. The concave portion 22 is formed so that it fitsthe shape of the molding resin 15 of the storage apparatus 10. In otherwords, since the molding resin 15 in the storage apparatus 10 accordingto the present invention is unsymmetrically disposed against the wiringsubstrate 11, the concave portion 22 of the support card 21 is formedcorresponding to the shape of the molding resin 15 of the storageapparatus 10. Thus, the concave portion 22 has a shoulder portioncorresponding to a frame area in which the molding resin 15 is notdisposed on the semiconductor device side of the wiring substrate 11.With the shoulder portion, the storage apparatus is supported. Dependingon the unsymmetrically disposed molding resin 15, the width of theshoulder portion may vary so that d1>d2 (where d1 is the width of theshoulder portion on one side of the concave portion 22; and d2 is thewidth of the shoulder portion on the other side of the concave portion22). With such a structure, the storage apparatus 10 can be properlyattached to the support card 21. Thus, when the card type storageapparatus is connected to a host side electronic apparatus such as adigital camera or a personal computer (including PC through a PCMCIAcard), the card type storage apparatus can be prevented frommalfunctioning and being damaged. In addition, the user-friendlinessremarkably improves.

[0118] The depth of the concave portion 22 of the support card 21 isslightly larger than the thickness of the storage apparatus 10. Thus,when the storage apparatus 10 is supported by the support card 21 orwhen electrodes of a host side electronic apparatus are accessed to theflat type external connection terminal 12 a, the stress applied in thedirection of the thickness of the storage apparatus can be alleviated.Consequently, the reliability of the storage apparatus 10 improves.

[0119] An adhesive tape may be placed on the shoulder portion of theconcave portion 22 so as to secure the storage apparatus 10. Byadjusting the adhesive strength of the adhesive tape to the wiringsubstrate 11 and the support card 21, when necessary, the storageapparatus 11 can be detached from the support card 21.

[0120] The support card 21 has a cut-out portion 23 and a write protectarea 24. With the cut-out portion 23, the operation voltage of thesemiconductor device 14 of the storage apparatus 10 is determined. Withthe write protect area 24, the data write enable state is determined.When a seal is adhered to the write protect area 24, data can beprohibited from being written to the storage apparatus 10.

[0121] When the outer size of the support card (base card) of the cardtype storage apparatus according to the present invention is the same asthat of for example a smart medium, data can be exchanged with a smallelectronic apparatus while maintaining electrical and mechanicalinterfaces with the smart medium.

[0122] (Third Embodiment)

[0123]FIGS. 6 and 7 are sectional views showing an example of thestructure of an electronic apparatus according to a third embodiment ofthe present invention.

[0124]FIG. 6 shows the state of which the storage apparatus 10 isdetached from the electronic apparatus 30 according to the presentinvention. FIG. 7 shows the state of which the storage apparatus 10according to the present invention is attached to the electronicapparatus 30 according to the present invention.

[0125] The electronic apparatus 30 comprises a concave portion 31, aconnection electrode 32, and a driving circuit (not shown). The concaveportion 31 supports the storage apparatus according to the presentinvention. When the storage apparatus 10 is supported with the concaveportion 31, the connection electrode 32 is connected to the flat typeconnection terminal 12 a of the storage apparatus 10. The drivingcircuit drives the semiconductor device 14 through the connectionelectrode 32 and the flat type external connection terminal 12 a. Thedriving circuit is for example a driver IC. The electronic apparatus isfor example a portable telephone unit, a PHS unit, a pocket bell, a PDA,a digital camera, a note type PC, a PC, a voice recorder, or anelectronic book.

[0126] The structure of the concave portion 30 of the electronicapparatus 30 is the same as the concave portion 22 of the support card21. Thus, the concave portion 31 has a shoulder portion corresponding toa frame area in which the molding resin 15 is not disposed on thesemiconductor device side of the wiring substrate 11 of the storageapparatus 10. With the shoulder portion, the storage apparatus issupported. Depending on the unsymmetrically disposed molding resin 15,the width of the shoulder portion may vary so that d1>d2 (where d1 isthe width of the shoulder portion on one side of the concave portion 31;and d2 is the width of the shoulder portion on the other side of theconcave portion 31).

[0127] With such a structure, the storage apparatus 10 can be properlyattached to the electronic apparatus 30. Thus, when the card typestorage apparatus is connected to the host side electronic apparatus 30such as a portable telephone unit, a PHS unit, a pocket bell, a PDA, aPC, or a digital camera, the storage apparatus 10 can be prevented frommalfunctioning and being damaged. In addition, the user-friendlinessremarkably improves.

[0128]FIG. 8 is a perspective view showing an example of the structureof the connection electrode 32 of the electronic apparatus 30 accordingto the third embodiment of the present invention.

[0129] The connection electrode 32 has a plurality of pins 32 acorresponding to the flat type external connection terminal 12 a of thestorage apparatus 10. The host side driving circuit is accessed to thesemiconductor device 14 through the pins 32 a and the flat type externalconnection terminal 12 a.

[0130] In the storage apparatus 10 according to the present invention,the molding resin 15 is unsymmetrically disposed. In addition, theconcave portion of the host side electronic apparatus 30 has theshoulder portion which realizes unsymmetry. Thus, the connectionelectrode 32 of the electronic apparatus 30 can be correctly connectedto the flat type external connection terminal 12 a of the storageapparatus 10. Consequently, the reliability of the system improves. Inaddition, the user-friendliness improves.

[0131] So far, it was difficult to accomplish an external connectingunit that can be used in common with a portable telephone unit, a PHSunit, a pocket bell, a PDA, a digital camera, a note type PC, a PC, andso forth. However, with the storage apparatus according to the presentinvention or the electronic apparatus according to the presentinvention, data such as telephone numbers stored in a portable telephoneunit and text data, picture data, and so forth received through Internetcan be transferred to another information processing unit or sharedtherewith. Likewise, such data can be transmitted. For example, with adigital camera or a portable telephone unit that can be accessed to thestorage apparatus according to the present invention, a picturephotographed by the digital camera can be easily transmitted through theportable telephone unit.

[0132] (Fourth Embodiment)

[0133]FIGS. 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19A, 19B, 19C and 19Dare plan views and sectional views showing examples of the structure ofa card type storage apparatus according to a fourth embodiment of thepresent invention.

[0134] The structure of the card type storage apparatus shown in FIG. 9is the same as the structure of the card type storage apparatus 20 shownin FIGS. 5A and 5B. The card type storage apparatus shown in FIG. 9comprises a storage apparatus 10 and a support card 21. The support card21 supports the storage apparatus 10.

[0135] The storage apparatus 10 has a structure shown in FIGS. 19A and19B. FIG. 19A is a sectional drawing parallel to a shorter side of thestorage apparatus. FIG. 19B is a sectional drawing parallel to a longerside of the storage apparatus.

[0136] In other words, the storage apparatus 10 shown in FIG. 3 isfitted to a frame member 10 a composed of synthetic resin. The storageapparatus 10 and the frame member 10 a are adhered with adhesive resina.

[0137] The frame member 10 a has a shoulder portion b and a hole portionc. With the shoulder portion b, a substrate 11 is fitted to the framemember 10 a. With the hole portion c, a molding resin portion 15 isfitted to the frame member 10 a. Since the storage apparatus 10 isfitted to the shouldered hole portion, the storage apparatus 10 isformed in a card shape.

[0138] In the storage apparatus 10, as shown in FIG. 19C, the moldingresin portion 15 may be disposed on the center of the substrate 11,instead of being disposed unsymmetrically against the substrate 11.

[0139] In addition, as shown in FIG. 19D, the frame member 10 a can besubstitute for the molding resin portion 15.

[0140] In the example shown in FIG. 9, the length L on the longer sideof the support card 21 is around 45.0 mm. The length S on the shorterside of the support card 21 is around 37.0 mm. When the storageapparatus 10 is detached from the support card 21 and only the storageapparatus 10 is attached to the host side electronic apparatus 30, theelectronic apparatus 30 can be compactly formed.

[0141] In the examples shown in FIGS. 10 to 18, the support card 21 isdetachable from the frame member 10 a including the storage apparatus orfrom the molding resin portion 15.

[0142] In the card type storage apparatus shown in FIG. 10, a supportcard 21 has a first area 21 a and a second area 21 b. The first area 21a is formed in a frame shape and surrounds the storage apparatus 10. Thesecond area 21 b is disposed outside the first area 21 a. In the cardtype storage apparatus shown in FIG. 10, the first area 21 a isdetachable from the second area 21 b.

[0143] The frame shape first area 21 a is the area in which the framemember 10 a substitute for the molding resin portion 15 shown in FIG.19D, or the storage apparatus 10 is fitted to a frame member 10 acomposed of synthetic resin and the storage apparatus 10 and the framemember 10 a are adhered with adhesive resin a shown in FIGS. 19A, 19Band 19C.

[0144] In the example, the support card 21 is formed in a rectangularshape of which the length Ls on the longer side of the first area 21 aof the support card is 30.0 mm and the length Ss on the shorter side ofthe first area 21 a of the support card is 19.0 mm.

[0145] In the card type storage apparatus shown in FIG. 11, a supportcard 21 has a first area 21 a and a second area 21 b. The first area 21a is formed in a frame shape and surrounds the storage apparatus 10. Thesecond area 21 b is disposed outside the first area 21 a. In the cardtype storage apparatus shown in FIG. 11, the first area 21 a isdetachable from the second area 21 b.

[0146] In the example, the support card 21 is formed in a rectangularshape of which the length Ls on the longer side of the first area 21 aof the support card is 30.0 mm and the length Ss on the shorter side ofthe first area 21 a of the support card is 23.0 mm.

[0147] In the card type storage apparatus shown in FIG. 12, a supportcard 21 has a first area 21 a and a second area 21 b. The first area 21a is formed in a frame shape and surrounds the storage apparatus 10. Thesecond area 21 b is disposed outside the first area 21 a. In the cardtype storage apparatus shown in FIG. 12, the first area 21 a isdetachable from the second area 21 b.

[0148] In the example, the support card 21 is formed in a rectangularshape of which the length Ls on the longer side of the first area 21 aof the support card is 35.5 mm and the length Ss on the shorter side ofthe first area 21 a of the support card is 19.0 mm.

[0149] In the card type storage apparatus shown in FIG. 13, a supportcard 21 has a first area 21 a and a second area 21 b. The first area 21a is formed in a frame shape and surrounds the storage apparatus 10. Thesecond area 21 b is disposed outside the first area 21 a. In the cardtype storage apparatus shown in FIG. 13, the first area 21 a isdetachable from the second area 21 b.

[0150] In the example, the support card 21 is formed in a rectangularshape of which the length Ls on the longer side of the first area 21 aof the support card is 30.0 mm and the length Ss on the shorter side ofthe first area 21 a of the support card is 23.0 mm.

[0151] In the card type storage apparatus shown in FIG. 14, a supportcard 21 has a first area 21 a and a second area 21 b. The first area 21a is formed in a frame shape and surrounds the storage apparatus 10. Thesecond area 21 b is disposed outside the first area 21 a. In the cardtype storage apparatus shown in FIG. 14, the first area 21 a isdetachable from the second area 21 b.

[0152] In the example, the support card 21 is formed in a rectangularshape of which the length Ls on the longer side of the first area 21 aof the support card is 37.0 mm and the length Ss on the shorter side ofthe first area 21 a of the support card is 25.0 mm.

[0153]FIGS. 15, 16, 17, and 18 are plan views showing the state that thefirst area 21 a of the card type storage apparatus is detached from thesecond area 21 b in the examples shown in FIGS. 10, 12, 13, and 14,respectively.

[0154] Thus, in the card type storage apparatus according to the presentinvention, the first area 21 a is detachable from the second area 21 b.Consequently, the card type storage apparatus can be attached to a hostside electronic apparatus that is smaller than the outer size of thesupport card 21.

[0155] The thickness of the card type storage apparatus according to thefourth embodiment is 0.76±0.08 mm. In the card type storage apparatusaccording to the present invention, the size and thickness thereof canbe adjusted when necessary.

[0156] (Fifth Embodiment)

[0157]FIG. 20 is a perspective view showing an example of the structureof a detachable card type storage apparatus according to a fifthembodiment of the present invention.

[0158] A first area 21 a and a second area 21 b of a support card haveshoulder portions formed on edge surfaces in parallel with the insertingdirection of the second area 21 b to the first area 21 a. The edgesurfaces of the first area 21 a are fitted to the edge surfaces of thesecond area 21 b. Steps of the shoulder portions of the second area 21 bhave protrusions 41 a. When the protrusions 41 a are fitted to holes 41b formed on the steps of the first area 21 a, the first area 21 a andthe second area 21 b are integrally secured.

[0159] (Sixth Embodiment)

[0160]FIG. 21 is a perspective view showing an example of the structureof a detachable card type storage apparatus according to a sixthembodiment of the present invention.

[0161] Edge surfaces in parallel with the inserting direction of asecond area 21 b of a support card to a first area 21 a thereof areformed in a curved shape. The edge surfaces of the first area 21 a arematched with the edge surfaces of the second area 21 b. When a sidesurface 21 t of the first area 21 a is fitted with a side surface 21 sof the second area 21 b and the first area 21 a is inserted in the arrowdirection, the first area 21 a can be integrally secured with the secondarea 21 b.

[0162] (Seventh Embodiment)

[0163]FIGS. 22A, 22B, 22C, and 22D are schematic diagrams showinganother example of the structure of a card type storage apparatusaccording to a seventh embodiment of the present invention.

[0164]FIG. 22A is a plan view showing the structure of the card typestorage apparatus according to the seventh embodiment. FIG. 22B is asectional view taken along line A-A shown in FIG. 22A. FIG. 22C is aperspective view showing the state that a first area 21 a is attached toa second area 21 b. FIG. 22D is a sectional view taken along line B-Bshown in FIG. 22A.

[0165] As with the above-described embodiments, the card type storageapparatus according to the seventh embodiment is structured in such amanner that the first area 21 a is detachable from the second area 21 b.In this example, an edge surface 21 t of the first area 21 a is tapered.On the other hand, an edge surface 21 s of the second area 21 b isreversely tapered so that the edge surface 21 s of the second area 21 bfits the edge surface 21 t of the first area 21 a. Only an area 43 ofthe edge surface of the first area 21 a is reversely tapered against theother part of the first area. An area corresponding to the area 43 ofthe second area 21 b of the support card has a nail-shaped hinge 44. Thehinge 44 is tapered so that it fits the area 43. In other words, thetapering direction of the side surface 21 s of the second area 21 b isreverse of that of the other portion.

[0166] With such a structure, the first area 21 a of the card typestorage apparatus can be secured with the second area 21 b thereof.

[0167] With such a structure, in the card type storage apparatusaccording to the present invention, since the first area 21 a isdetachable from the second area 21 b, the first area 21 a can beattached to a host side electronic apparatus smaller than the outer sizeof the support card.

[0168] (Eighth Embodiment)

[0169]FIGS. 23A, 23B, and 23C are schematic diagrams showing thestructure of a support card of a card type storage apparatus accordingto an eighth embodiment of the present invention. FIGS. 24A, 24B, and24C are schematic diagrams showing the structure of a storage apparatusattached to the support card shown in FIGS. 23A, 23B, and 23C.

[0170]FIG. 23A is a plan view showing the structure of the support card.FIG. 23B is a sectional view taken along line A-A shown in FIG. 23A.FIG. 23C is a sectional view showing the structure of a support cardaccording to another embodiment corresponding to FIG. 23B. FIG. 24A is aplan view showing the structure of the storage apparatus. FIG. 24B is asectional view taken along line B-B shown in FIG. 24A. FIG. 24C is asectional view taken along line C-C shown in FIG. 24C.

[0171] The support card 50 of the card type storage apparatus has acut-out portion 51 for detaching a storage apparatus. A bottom portionto which the storage apparatus is attached is composed of a SUS plate 52that is integrally formed with mold resin. Edge portions of the SUSplate 52 are inwardly bent for 60° so as to form a slide groove. Inaddition, a resin mold portion connected to the SUS plate 52 is alsoinwardly bent for 60°.

[0172] The length L on the longer side of the support card 50 is around45.0 mm. The length S on the shorter side of the support card is around37.0 mm. The width of the inner bottom surface of the SUS plate 52 inthe slide groove shape is 19.5 mm. A notch 54 is formed at the rear edgeof the storage apparatus 53 of the card type storage apparatus. Bothside edges of the storage apparatus 53 are tapered at an angle of around600 so that the storage apparatus 53 is inserted into a concave portionof the slide groove of the support card 50. The length L on the longerside of the storage apparatus 53 is around 33.5 mm. The length S on theshorter side of the storage apparatus 53 is around 19.0 mm.

[0173] Since the storage apparatus 53 is detached from the support card50 and the only the storage apparatus 53 is attached to a host sideelectronic apparatus, the electronic apparatus 53 can be compactlystructured.

[0174]FIGS. 25A and 25B show another example of the structure of thestorage apparatus 55 used for the card type storage apparatus accordingto the present invention.

[0175]FIG. 25A is a perspective view showing the storage apparatus. FIG.25B is a sectional view taken along line A-A of FIG. 25A. The storageapparatus 55 is fitted to a frame member 56 composed of synthetic resin.The storage apparatus 55 and the frame member 56 are integrally adheredwith adhesive resin so as to result in a card shape as a whole.

[0176] The frame member 56 has a shoulder portion b and a hole portionc. The substrate 55 a is fitted to the shoulder portion b. A moldingresin portion 55 b is fitted to the hole portion c. When the storageapparatus 55 is fitted to the shoulder portion b and the hole portion c,the storage apparatus 55 is formed in a card shape.

[0177] Uneven portions 57 are formed on both the front and rear surfaceof the frame member 56. With the uneven portions 57, the user can easilyattach/detach the storage apparatus 56 to/from the frame member 56. Inaddition, a hole 58 that fits a protrusion of the support card is formedon the frame member 56 so as to secure the storage apparatus 55 to thesupport card. A peripheral portion of the hole 58 of the frame member 56is structured so that the hole is fitted to or separate from theprotrusion of the support card with a click function.

[0178] Further, FIG. 25C shows the state that the storage apparatus 55of FIG. 25A is inserted into the support card 50.

[0179] (Ninth Embodiment)

[0180]FIG. 26 is a block diagram showing the structure of which a cardtype storage apparatus according to the present invention is applied toa picture/audio storage medium of a digital audio system.

[0181] The card type storage apparatus (smart medium) according to thepresent invention is connected to a smart medium controller through aconnector. The smart medium controller inputs and outputs picture/audioinformation through an interface under the control of a CPU.

[0182] A digital signal that is read from the smart medium is suppliedto a decoder through the CPU. The decoder decodes the digitalinformation into a picture signal or an audio signal. The picture signalis reproduced by an LCD. The audio information is reproduced by an audiounit (not shown) through an audio interface. An input signal is suppliedto an encoder. The encoder encodes the input signal into a digitalsignal. The digital signal is recorded to the smart medium through theinterface. When a signal is input/output, when necessary, the signal isencrypted or decrypted.

[0183] These operations are performed with for example key switches.

[0184] According to the present invention, since the molding resin isunsymmetrically disposed on the wiring substrate, the storage apparatuscan be properly attached to the host side unit. Thus, theuser-friendliness improves. In addition, the semiconductor apparatus canbe prevented from malfunctioning and being damaged.

[0185] In the storage apparatus according to the present invention,since the serial access type memory device and the flat type externalconnection terminal are used in combination, the outer size of thestorage apparatus becomes close to the outer size of the memory device.Thus, the storage apparatus according to the present invention issuitable for an external storage apparatus used in a small mobilecommunication terminal such as a portable telephone unit, a PHS unit, apocket bell, or a PDA.

[0186] In addition, when the serial access type memory device and theflat type external connection terminal are used in combination, thestructure of the flat type external connection electrodes of the storageapparatus and the structure of the host side electronic apparatus can bestandardized.

[0187] In the card type storage apparatus according to the presentinvention, since the molding resin of the storage apparatus isunsymmetrically fitted to the support card, the storage apparatus can beproperly attached to the support card. Thus, the user-friendlinessimproves. Consequently, the storage apparatus can be prevented frommalfunctioning and being damaged.

[0188] In the card type storage apparatus according to the presentinvention, since the support card is separated into a plurality ofportions, the storage apparatus can be connected to a host side unitthat is smaller than the outer size of the support card.

[0189] In the electronic apparatus according to the present invention,the storage apparatus can be properly attached to the electronicapparatus. Thus, when the storage apparatus is connected to a host sideelectronic apparatus such as a portable telephone unit, a PHS unit, apocket bell, a PDA, a PC, or a digital camera, the electronic apparatuscan be prevented from malfunctioning or being damaged. In addition, theuser-friendliness remarkably improves. So far, it was difficult toaccomplish an external connecting unit that can be used in common with aportable telephone unit, a PHS unit, a pocket bell, a PDA unit, adigital camera, a note type PC, a PC, and so forth. However, with thestorage apparatus and the electronic apparatus according to the presentinvention, data such as telephone numbers registered to a portabletelephone unit and text data, picture data, and so forth receivedthrough Internet can be transferred to and shared with other informationprocessing units.

[0190] Although the present invention has been shown and described withrespect to a best mode embodiment thereof, it should be understood bythose skilled in the art that the foregoing and various other changes,omissions, and additions in the form and detail thereof may be madetherein without departing from the spirit and scope of the presentinvention.

What is claimed is:
 1. A storage apparatus, comprising: a wiringsubstrate having a first surface and a second surface; a flat typeexternal connection terminal disposed on the first surface of saidwiring substrate; a semiconductor device disposed on the second surfaceof said wiring substrate and having a connection terminal connected tosaid flat type external connection terminal; and card type molding resinfor coating said semiconductor device on the second surface of saidwiring substrate with the same height as an exposed surface of said flattype external connection terminal.
 2. The storage apparatus as set forthin claim 1, wherein the area of a card type molding resin portion is thehalf or less of the area of said flat type external connection terminal.3. The storage apparatus as set forth in claim 1, wherein saidsemiconductor device is a serial access type semiconductor.
 4. Thestorage apparatus as set forth in claim 1, wherein said semiconductordevice is a flash memory.
 5. The storage apparatus as set forth in claim1, wherein said semiconductor device is a NAND type EEPROM or an ANDtype EEPROM.
 6. The storage apparatus as set forth in claim 1, whereinsaid flat type external connection terminal is composed of a conductorlayer disposed on the first surface of said wiring substrate and havinga slit for separating the first surface into a plurality of areas. 7.The storage apparatus as set forth in claim 6, wherein a pattern of theslit connects any two points of the outer periphery of the conductorlayer as a curved line or a bent line.
 8. A storage apparatus,comprising: a wiring substrate having a first surface and a secondsurface; a flat type external connection terminal disposed on the firstsurface of said wiring substrate; a semiconductor device disposed on thesecond surface of said wiring substrate and having a connection terminalconnected to said flat type external connection terminal; molding resinfor coating said semiconductor device on the second surface of saidwiring substrate; a card type supporting frame having a concave portionor a hole portion formed on at least one surface of said card typesupporting frame, the concave portion or the hole portion fitting saidwiring substrate, said semiconductor device, and said molding resin insuch a manner that said flat type external connection terminal isexposed to the first surface of said wiring substrate; and adhesiveresin filled in a supporting space formed among at least one of saidflat type external connection terminal, said wiring substrate, saidsemiconductor device, said molding resin, and said card type supportingframe so as to integrally adhere said flat type external connectionterminal, said wiring substrate, said semiconductor device, said moldingresin, and said card type supporting frame.
 9. The storage apparatus asset forth in claim 8, wherein a molding resin free portion is formed atan edge portion of said flat type external connection terminal, aconcave portion or a hole portion of said card type supporting framebeing a shouldered concave portion or a shouldered hole portion having afirst portion and a second portion, the first portion being fitted tothe molding resin free portion of said flat type external connectionterminal, the second portion being fitted to the molding resin portionof said flat type external connection terminal.
 10. The storageapparatus as set forth in claim 8, wherein the area of said card typesupporting frame is the half or less of the area of said flat typeexternal connection terminal.
 11. The storage apparatus as set forth inclaim 8, wherein said semiconductor device is a serial access typesemiconductor.
 12. The storage apparatus as set forth in claim 8,wherein said semiconductor device is a flash memory.
 13. The storageapparatus as set forth in claim 8, wherein said semiconductor-device isa NAND type EEPROM or an AND type EEPROM.
 14. The storage apparatus asset forth in claim 8, wherein said flat type external connectionterminal is composed of a conductor layer disposed on the first surfaceof said wiring substrate and having a slit for separating the firstsurface into a plurality of areas.
 15. The storage apparatus as setforth in claim 14, wherein a pattern of the slit connects any two pointsof the outer periphery of the conductor layer as a curved line or a bentline.
 16. A card type storage apparatus, comprising: a storage apparatushaving: a wiring substrate having a first surface and a second surface,a flat type external connection terminal disposed on the first surfaceof said wiring substrate, a semiconductor device disposed on the secondsurface of said wiring substrate and having a connection terminalconnected to said flat type external connection terminal, and card typemolding resin for coating said semiconductor device on the secondsurface of said wiring substrate with the same height as an exposedsurface of said flat type external connection terminal; and card typesupporting means having a first surface and for detachably supportingsaid storage apparatus in such a manner that said flat type externalconnection terminal is exposed to the first surface of said card typesupporting means.
 17. The card type storage apparatus as set forth inclaim 16, wherein said supporting means has a concave portion with ashoulder corresponding to a card type molding resin portion disposed ona first surface of said supporting means.
 18. The card type storageapparatus as set forth in claim 17, wherein said supporting means has aconcave portion and a slit formed on a first surface thereof, the cardtype supporting frame being inserted into the concave portion, the slitbeing formed on both edge surfaces of the concave portion along theinsertion direction of the card type molding resin so that the card typemolding resin is fitted to said supporting means.
 19. The card typestorage apparatus as set forth in claim 17, wherein said supportingmeans has a tapered overhang portion for nipping the card type moldingresin portion, the tapered overhang portion being disposed on both edgesurfaces of the concave portion along the insertion direction.
 20. Thecard type storage apparatus as set forth in claim 17, wherein a bottomplate of the concave portion is composed of a metal plate.
 21. The cardtype storage apparatus as set forth in claim 17, further comprising:securing means for securing said storage apparatus supported by saidsupporting means.
 22. The card type storage apparatus as set forth inclaim 17, wherein the supporting means is composed of a first portionand a second portion, the first portion surrounding the storageapparatus, the second portion being detachably connected to the firstportion.
 23. The card type storage apparatus as set forth in claim 16,wherein said supporting means is flexible.
 24. A card type storageapparatus, comprising: a storage apparatus having: a wiring substratehaving a first surface and a second surface, a flat type externalconnection terminal disposed on the first surface of said wiringsubstrate, a semiconductor device disposed on the second surface of saidwiring substrate and having a connection terminal connected to said flattype external connection terminal, molding resin for coating saidsemiconductor device on the second surface of said wiring substrate, acard type supporting frame having a concave portion or a hole portionformed on at least one surface of said card type supporting frame, theconcave portion or the hole portion fitting said wiring substrate, saidsemiconductor device, and said molding resin in such a manner that saidflat type external connection terminal is exposed to the first surfaceof said wiring substrate, and adhesive resin filled between at least oneof said flat type external connection terminal, said wiring substrate,said semiconductor device and said molding resin, and said card typesupporting frame so as to integrally adhere said flat type externalconnection terminal; and card type supporting means having a firstsurface and for detachably supporting said storage apparatus in such amanner that said flat type external connection terminal is exposed tothe first surface of said card type supporting means.
 25. The card typestorage apparatus as set forth in claim 24, wherein said supportingmeans has a concave portion with a shoulder corresponding to a card typesupporting frame disposed on a first surface of said supporting means.26. The card type storage apparatus as set forth in claim 25, whereinsaid supporting means has a concave portion and a slit formed on a firstsurface thereof, the card type supporting frame being inserted into theconcave portion, the slit being formed on both edge surfaces of theconcave portion along the insertion direction of the card typesupporting frame so that the card type supporting frame is fitted tosaid supporting means.
 27. The card type storage apparatus as set forthin claim 25, wherein said supporting means has a tapered overhangportion for nipping the card type supporting frame, the tapered overhangportion being disposed on both edge surfaces of the concave portionalong the insertion direction.
 28. The card type storage apparatus asset forth in claim 24, wherein a bottom plate of the concave portion iscomposed of a metal plate.
 29. The card type storage apparatus as setforth in claim 25, further comprising: securing means for securing saidstorage apparatus supported by said supporting means.
 30. The card typestorage apparatus as set forth in claim 25, wherein the supporting meansis composed of a first portion and a second portion, the first portionsurrounding the storage apparatus, the second portion being detachablyconnected to the first portion.
 31. The card type storage apparatus asset forth in claim 24, wherein said supporting means is flexible.
 32. Anelectronic apparatus, comprising: a storage apparatus having: a wiringsubstrate having a first surface and a second surface, a flat typeexternal connection terminal disposed on the first surface of saidwiring substrate, a semiconductor device disposed on the second surfaceof said wiring substrate and having a connection terminal connected tosaid flat type external connection terminal, and a card type moldingresin layer for coating said semiconductor device on the second surfaceof said wiring substrate with the same height as an exposed surface ofsaid flat type external connection terminal; supporting means forsupporting said storage apparatus; a connection electrode that iscontacted to said flat type connection terminal when said storageapparatus is supported by said supporting means; and a driving circuitfor accessing said semiconductor device through said connectionelectrode and said flat type external connection terminal.
 33. Theelectronic apparatus as set forth in claim 32, wherein said drivingcircuit serially accesses said semiconductor device.
 34. An electronicapparatus, comprising: a wiring substrate having a first surface and asecond surface, a flat type external connection terminal disposed on thefirst surface of said wiring substrate, a semiconductor device disposedon the second surface of said wiring substrate and having a connectionterminal connected to said flat type external connection terminal,molding resin for coating said semiconductor device on the secondsurface of said wiring substrate, a card type supporting frame having aconcave portion or a hole portion formed on at least one surface of saidcard type supporting frame, the concave portion or the hole portionfitting said wiring substrate, said semiconductor device, and saidmolding resin in such a manner that said flat type external connectionterminal is exposed to the first surface of said wiring substrate, andadhesive resin filled in a supporting space formed among said flat typeexternal connection terminal, said wiring substrate, said semiconductordevice, said molding resin, and said card type supporting frame so as tointegrally adhere said flat type external connection terminal, saidwiring substrate, said semiconductor device, said molding resin, andsaid card type supporting frame; supporting means for supporting saidstorage apparatus; a connection electrode that is contacted to said flattype connection terminal when said storage apparatus is supported bysaid supporting means; and a driving circuit for accessing saidsemiconductor device through said connection electrode and said flattype external connection terminal.
 35. The electronic apparatus as setforth in claim 34, wherein said driving circuit serially accesses saidsemiconductor device.